Zigzag-stacked package structure

ABSTRACT

A die-stacked package structure, wherein a plurality of dies are stacked on the substrate with a rotation so that a plurality of metallic ends and the metal pad on each die on the substrate can all be exposed; a plurality of metal wires are provided for electrically connecting the plurality of metal pads on the plurality of dies with the plurality metallic ends on the substrate in one wire bonding process; then an encapsulate is provided for covering the plurality of stacked dies, a plurality of metal wires and the plurality of metallic ends on the substrate.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention is a multi-dies stacked package structure, more particularly; it is a zigzag-stacked package structure.

2. Description of the Prior Art

In recent years, the semiconductor package process is using three-dimension (3D) package method to have relative large integrated semiconductor or the volume of the memory in the less measure of area. In order to achieve this object, the die stacked method is used to have 3D package structure.

In the prior art, the stacked method of the dies is used a plurality of dies to stack to each other on one substrate and the wire bonding process is used to electrically connect the dies and the substrate. FIG. 1 a is a sectional view showing a zigzag-stacked package structure with similar size of the dies in the prior art. As shown in FIG. 1 a, the zigzag-stacked package structure 100 includes a circuit substrate 110, die 120 a, die 120 b, a spacer 130, a plurality of wires 140 and an encapsulated material 150. The circuit substrate 110 includes a plurality of pads and the die 120 a and die 120 b respectively includes a plurality of pads 122 a and 122 b. The pads 122 a and 122 b are arranged around the die 120 a and 120 b in a peripheral type. The die 120 a is disposed on the circuit substrate 110 and the die 120 b is disposed between the spacer 130 and the top of the die 120 a. Two ends of the wires 140 are connected to pads 112 and 122 b by a wire bonding process and the die 120 b is electrically connected to the circuit substrate 110. The encapsulated material 150 is disposed on the circuit substrate 110 and covering the wires 140, the die 120 a and 120 b.

Because the pads 122 a and 122 b are arranged on the die 120 a and 120 b in a peripheral type, the die 120 a is not able to support the die 120 b. So, in the package process, after the die 120 a is connected to the circuit substrate 110, the pads 122 a on the die 120 a is connected to the pads 112 on the circuit substrate 110 by a wire bonding process. The spacer 130 is connected to the die 120 a and the die 120 b is connected on the spacer 130, and the pads 122 on the die 120 b is connected to the pads 112 on the circuit substrate 110 by another one wire bonding process. Obviously, the spacer 130 is disposed between the die 120 a and 120 b and there is a distance between the die 120 a and 120 b to protect the wires 140. However, the usage of the spacer 130 causes the difficulty to reduce the thick of the zigzag-stacked package structure 100.

Besides, another one zigzag-stacked package structure with different die size is provided in prior art, as the sectional view shown in FIG. 1B. The zigzag-stacked package structure 10 includes a package substrate 110, die 120 c, die 120 d, a plurality of wires 140 and an encapsulated material 150. The circuit substrate 110 includes a plurality of pads 112. The size of the die 120 c is bigger than the size of the die 120 d. The die 120 c and 120 d respectively includes a plurality of die 122 c and 122 d. The pads 122 c and 122 d are arranged on the die 120 c and 120 d in a peripheral type. The die 120 c is disposed on the package substrate 110 and the die 120 d is disposed on the die 120 c. Two ends of some of the wires 140 are connected to the pads 112 and 122 c by wire bonding process and the die 120 c is able to electrically connect to the circuit substrate 110. Two ends of the other wires 140 are connected to the pads 112 and 122 d by wire bonding process and the die 120 d is able to electrically connect to the circuit substrate 110. The encapsulated material 150 is disposed on the circuit substrate 110 and covering the wires 140, the die 120 c and 120 d.

Because the die 120 d is smaller than the die 120 c, the die 120 d is not able to cover the die 120 c when the die 120 d is disposed on the die 120 c. Therefore, the package process is different to the process in FIG. 1A. The die 120 c and 120 d are connected to the package substrate 110 first and then doing one time wire bonding process. When the dies with different size are stacked together to form a zigzag-stacked package structure in prior art, the size of the die on the topper is smaller, therefore the number of the dies is limited.

According to the two stacked method described above, the spacer 130 used in FIG. 1A is not easy to reduce the thick of the zigzag-stacked package structure and the size of the die on the topper has to be smaller in FIG. 1B to limit the design and the usage of the dies. According to the problem above, U.S. Pat. No. 6,252,305, U.S. Pat. No. 6,359,340 and U.S. Pat. No. 6,461,897 provides another zigzag-stacked package structure, as shown in FIG. 1C. Obviously, the package structure uses the dies with the same sizes, therefore there is no spacer 130 used to connect the dies and the substrate. However, during the stacking steps, the dies are stacked to each other by using at least two types of pads. For example, the pads on the first dies are disposed on one side of the first dies and the pads on the second dies are disposed on the two adjacent sides. Besides, the package structure needs the wire bonding process to use in two directions. Therefore, as the structure shown in FIG. 1C, it would increase the time of wire bonding process and it would cause asymmetrical molding flow during the molding process. The wire in one direction would hit by the transversal molding strength and the connection of the wires is caused the malfunction of the dies.

Besides, U.S. Pat. No. 6,900,528, U.S. patent No. 20030137042A1, U.S. patent No. 20050029645A1 and U.S. patent No. 20060267173A1 disclosed another zigzag-stacked package structure. Obviously, the height between the dies is used to replace the spacer to increase the density of the package structure. However, there are some problems in the manufacture of the package structure. After two dies are connected together, the first time of the wire bonding process is in proceeding, do the connection of another two dies and the second time of the wire bonding process. When the number of dies is increased, the package process is become more and more complicated.

SUMMARY OF THE INVENTION

According to the drawbacks and the problems of prior art described above, there is a zigzag-stacked package structure is used in the present invention to stack the dies with similar size in a three-dimension package structure.

The main object of the present invention is to provide a zigzag-stacked package structure with higher package density and thinner thickness.

Another object of the present invention is to provide a zigzag-stacked package structure with balance molding effect during the molding process.

Another object of the present invention is to provide a zigzag-stacked package structure including a bus bar to have better flexibility of circuit design and the reliability.

According the objects described above, the present invention provides a zigzag-stacked package structure. The zigzag-stacked package structure includes a lead frame, a zigzag-stacked package structure and an encapsulated material. The lead frame includes a plurality of inner leads, a plurality of outer leads and a die paddle and wherein the die paddle is disposed between the inner leads and a height difference formed between the die paddle and the inner leads. The zigzag-stacked structure is connected on the die paddle and the zigzag-stacked structure includes a plurality of first dies and a plurality of second dies, which are alternatively and respectively stacked to each other, and the first dies, the second dies and the inner leads are electrically connected. The encapsulated material covering the zigzag-stacked structure and the lead frame, and the outer leads are extended over the encapsulated material. Wherein one side of an active surface on each of the first dies and the second dies structure respectively includes a plurality of pads disposed thereon and the other side of an active surface on each of the first dies and the second dies structure respectively includes a plurality of pads disposed thereon.

The present invention also provides a zigzag-stacked package structure. The zigzag-stacked package structure includes a lead frame, a zigzag-stacked structure and an encapsulated material. The lead frame includes a plurality of inner leads, a plurality of outer leads, at least one bus bar and a die paddle, and wherein the die paddle is disposed between the inner leads and a height difference formed between the die paddle and the inner leads, the bus bar is disposed between the inner leads and the die paddle. The zigzag-stacked structure is connected on the die paddle and the zigzag-stacked structure includes a plurality of first dies and a plurality of second dies, which are alternatively and respectively stacked to each other, and the first dies, the second dies and the inner leads are electrically connected. The encapsulated material covers the zigzag-stacked structure and the lead frame, and the outer leads are extended over the encapsulated material. One side of an active surface on each of the first dies and the second dies structure respectively includes a plurality of pads disposed thereon and the other side of an active surface on each of the first dies and the second dies structure respectively includes a plurality of pads disposed thereon.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing aspects and many of the attendant advantages of this invention will become more readily appreciated as the same becomes better understood by reference to the following detailed description, when taken in conjunction with the accompanying drawings, wherein:

FIGS. 1A˜1C are views in prior art.

FIGS. 2A and 2C are top views of the die structure in the present invention.

FIGS. 2B and 2D are sectional views of the die structure in the present invention.

FIG. 2E is a section view of a zigzag-stacked structure in the present invention.

FIGS. 3A˜3C are views of a manufacture procedure of a redistribution layer in the present invention.

FIGS. 4A˜4B are section views of the wire bonding are of the redistribution layer in the present invention.

FIG. 5 is a sectional view of a zigzag-stacked structure with a redistribution layer in the present invention.

FIG. 6 is a sectional view of a zigzag-stacked structure in another embodiment of the present invention.

FIG. 7 is a top view of a zigzag-stacked structure in the present invention.

FIG. 8 is a sectional view of a zigzag-stacked structure in the present invention.

FIG. 9 is a top view of a zigzag-stacked structure with a bus bar in another embodiment of the present invention.

FIG. 10 is a sectional view of a zigzag-stacked structure with a bus bar in another embodiment of the present invention.

FIG. 11 is top view of a zigzag-stacked structure in another embodiment of the present invention.

FIG. 12 is a sectional view of a zigzag-stacked structure in another embodiment of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENT

The detailed description of the present invention will be discussed in the following embodiments, which are not intended to limit the scope of the present invention, but can be adapted for other applications. While drawings are illustrated in details, it is appreciated that the quantity of the disclosed components may be greater or less than that disclosed, except expressly restricting the amount of the components.

The semiconductor package structure in these years is to package a wafer in front end process to do the thinning execution. The thinning process is to grind the die with the size between 2˜20 mils and then do the process of coating or printing a polymer on the reverse side of the die. The material of polymer is a resin, such as a B-Stage resin. After a baking or photo-lighting process, the polymer is become a sticky gluing material. After the baking process, a removable tape is stuck on the polymer. The wafer is on sawing process, the wafer is cut to be a plurality of dies. At final, each of the dies is connected on the substrate and the dies are stacked together to form a stacked package.

First, please refer to FIG. 2A and FIG. 2B, FIG. 2A and FIG. 2B are plan view and sectional view of die 200 shown in previous description. As shown in FIG. 2A, the die 200 includes an active surface 210 and a reverse surface 220 corresponding to the active surface 210. There is an adhesive layer 230 formed on the reverse surface 220 of the die 200. It should be noted that the adhesive layer 230 in the present invention is the sticky gluing material described above, but not limited.

The object of the adhesive layer 230 is to connect the lead frame or the die 200. Therefore, any package structure with this adhesive material, such as die attached film, is included in the present invention. Besides, in the embodiment of the present invention, there is a plurality of pads 240 on the active surface 210 of the die 200 and the pads 240 are disposed on one side of the die 200. There are a plurality of pads 240 on the active surface 210 of the other die 20 and the pads 240 are disposed the other side of the die 200. It should be noted that the pads 240 on the die 20 and die 200 are disposed on the responding sides, as shown in FIG. 2C and FIG. 2D. Therefore, a zigzag-stacked structure 30 is formed, as shown in FIG. 2E. When the zigzag-stacked structure 30 is formed in the present invention, the stacked area between dies is determined by the number of the dies. For example, the two dies 20 a and 200 a on the bottom layer are connected by the adhesive layer 230, the stacked area of the die 20 a and die 200 a is more than a half of the stacked area of die 20 a or 200 a. The larger stacked area is in the topper level of the die. Each of the die is formed at the edge line 260 of the wire bonding region 250. Therefore, a step like die stacked package structure is formed. The pads disposed on the die are not covered by the top die. Besides, it should be noted that the edge line 260 actually is not existed on the die and it is just a reference line. In an embodiment, the size of the die 20 or die 200 is about 10 mm*13 mm*75 um and the thick of the adhesive layer 230 on the reverse surface of the die is about 60 um. The thickness of the package substrate used to support the zigzag-stacked structure is about 200 um 250 um. According to the size of the package structure of the die, the biggest overhand wide of the zigzag-stacked structure is about 1 mm for a six levels dies and less than 1.5 mm for an eight levels dies. It should be noted that it is not limited for the size of the zigzag-stacked structure to describe above. As long as the zigzag-stacked structure is formed according to the description above is included in the present invention. For example a two levels zigzag-stacked structure and a four levels zigzag-stacked structure.

Now it is an embodiment of the present invention for a die 200 or a die 20 including a plurality of pads disposed thereon. In the present invention, it is using a redistribution layer (RDL) to put the pads of the die on one side of the die to form a zigzag-stacked structure. The steps to form the redistribution layer are described in the following.

FIGS. 3A˜3C are views showing manufacture steps of the redistribution layer of the die in the present invention. As shown in FIG. 3A, a die 310 is provided and it designs a wire bonding region 320 on one side of the die 310 and the pads 312 on the active surface of the die are divided into first pads 312 a and second pads 312 b. The first pads 312 a are disposed within the wire bonding region 320 and the second pads 312 b are disposed outside of the wire bonding region 320. Now please refer to FIG. 3B, there is a protective layer 330 is formed on the die 310 and the protective layer 330 includes a plurality of openings used to expose the first pads 312 a and the second pads 312 b. Then, a redistribution layer 340 is formed on the protective layer 330. The redistribution layer 340 includes a plurality of wires 342 and a plurality of third pads 344. The third pads 344 are disposed within the wire bonding region 320 and the wires 342 are extended from the second pads 312 b to the third pads 344. The second pads 312 b are able to electrically connect the third pads 344. Besides, the material of the redistribution layer 340 is gold, copper, nickel, titanium tungsten, titanium and any other conductive metals. Now please refer to FIG. 3C, after forming the redistribution layer 340, the second protective layer 350 covers the redistribution layer 340 to form the structure of the die 300. The second protective layer 350 includes a plurality of second openings 352 to expose the first pads 312 a and the third pads 344.

It should be noted that the first pads 312 a and the second pads 312 b are arranged on the active surface of the die 310 in a peripheral type. The first pads 312 a and the second pads 312 b are able to be arranged on the active surface of the die 310 in an area array type or any other different types. The second pads 312 b are electrically connected to the third pads by wires 342. Besides, the arranged method of the third pads 344 is not limited in the present embodiment. Although the third pads in FIG. 3B and the first pads 312 a are arranged in two lines and line up along one side of the die 310. The third pads 344 and the first pads 312 a are able to arrange in single line, multi lines or any other types within the wire bonding region 320.

Please refer to FIGS. 4A and 4B, those are sectional views according to the sectional line A-A′ and B-B′ in FIG. 3C. As the description in FIG. 3C, the die 300 includes die body 310 and the redistribution layer 400. The redistribution layer 400 is composed by the first protective layer 330, the redistribution layer 340 and the second protective layer 350. The die body 310 includes the wire bonding region 340 a and the wire bonding region is close to one side of the die body 310. Besides, the first pads 312 a are disposed within the wire bonding regions 320 and the second pads 312 b are disposed outside of the wire bonding region 320.

The first protective layer 330 is disposed on the die body 310 and includes a plurality of opening used to expose the first pads 312 a and the second pads 312. The redistribution layer 340 is disposed on the first protective layer 330 and extended from the second pads 312 b to the wire bonding regions. The redistribution layer 340 includes a plurality of third pads 344 disposed within the wire bonding region 320. The second protective payer 350 includes a plurality of second openings 352 to expose the first pads 312 a and the third pads 344. Obviously, the first pads 312 a and the third pads 344 are able to be disposed the other side of the die by the same package process.

FIG. 5 is a view showing a zigzag-stacked structure in the present invention. The zigzag-stacked structure 50 is composed by stacking a plurality of dies 500. For example, there are four dies stacked to each other and each of the dies includes a redistribution layer 400. Therefore, the pads 312 b on the dies are disposed on the wire bonding region 320 of the dies to form the zigzag-stacked structure 50. The stacked method of the zigzag-stacked structure 50 is the same as the zigzag-stacked structure 30 described above, the detailed description was omitted. Besides, there is an adhesive layer 230, such as polymer, used to connect the dies 500 and form the zigzag-stacked structure.

Besides the zigzag-stacked structures in the present invention are described above, the zigzag-stacked structure 30 and 50, the die 20 is able to stack on the dies 500 with the redistribution layer 400 to form another kind of the zigzag-stacked structure. As shown in FIG. 6, there are six dies stacked together. Because the stacked method of the zigzag-stacked structure 70 is the same as the stacked method of the zigzag-stacked structure 30 and 50, so the detail description of the stacked method is omitted. It should be noted that the die 20 and the die 500 in the present embodiment is not limited to specify which die on top or which die on bottom. As long as the zigzag-stacked structure is formed by the die 20 or die 500 is included in the present invention. Also, it should be noted that the number of dies to form the zigzag-stacked structure is not limited in the present invention. For example, there are four dies stacked together as shown in FIG. 5 and there are six dies stacked together as shown in FIG. 6. Of course, it can be another kind of composition to form the zigzag-stacked structure by satisfying the description above is includes in the present invention.

There is another zigzag-stacked structure provided according to the zigzag-stacked structure 30, 50 and 70 described above. In the following description, the zigzag-stacked structure 50 is used but the zigzag-stacked structures 30 and 70 are also suitable in the following description.

FIG. 7 is a plan view showing the zigzag-stacked package structure in the present invention. As shown in FIG. 7, the zigzag-stacked package structure includes a lead frame 600 and a zigzag-stacked structure 50A. The lead frame 600 includes a plurality of inner leads 610, a plurality of outer leads (not shown) and a die paddle 620. The die paddle 620 is disposed between the corresponding inner leads 610. There is a height difference formed between the corresponding inner leads 610 and the die paddle 620. In this embodiment, the zigzag-stacked structure 50A is disposed and connected on the die paddle 620 by an adhesive layer 230. The adhesive layer 230 in the present invention is a sticky gluing material as described above but not limited. The adhesive layer 230 is used to connect the zigzag-stacked structure 50A and the die paddle 620. Therefore, any package structures with the same function of the adhesive material, such as die attached film, are includes in the present invention. It should be noted that, in the real package process, there are two ways to form the zigzag-stacked package structure. One is to stack a plurality of dies first and then connect with the lead frame. The other one is to connect the die on the bottom and the lead frame and then sequentially stack the dies one after another. No matter what kind of the package method to form the zigzag-stacked structure 50A, the wires 640 are used to connect the zigzag-stacked structure 50A and the inner leads 610 of the lead frame 600 after stacking the dies. Obviously, the zigzag-stacked package structure in the present invention is to connect the dies and the lead frame first and then do the wire bonding process to simplify the package procedure. It should be noted that the pads disposed on the dies are not covered by the top die in each of the zigzag-stacked structures in the present invention. Therefore, the dies are able to connect to the lead frame and then do the wire bonding process. Because the procedure that the wire 640 is used to connect the dies and the lead frame 600 is a prior art, the detail description is omitted.

FIG. 8 is a sectional view showing a zigzag-stacked package structure in the present invention (according to the sectional line AA in FIG. 7). As shown in FIG. 8, the lead frame 600 is stacked with six dies 500 to form the zigzag-stacked package structure and is connected by a plurality of wires 640. The lead frame 600 includes a plurality of corresponding inner leads, a plurality of outer leads and a die paddle 620. The die paddle 620 is disposed between the corresponding inner leads 610 and a height difference is formed between the die paddle 602 and the inner leads 610. One end of the wire 640 a is connected to the first pads 312 a of the die 500 a or the third pads 344 (as the first pads 312 a or the third pads 344 in FIG. 3). The other end of the wires 640 is connected to the first pads 312 a of the die 500 b or the third pads 344. Then, one end of the wire 640 b is connected to the first pads 312 a of the die 500 b or the third pads. The other end of the wire 640 b is connected to the first pads 312 a of the die 500 c or the third pads 344. The wire 640 c is sued to electrically connect the die 500 a and the corresponding inner lead 610 of the lead frame 600. The steps described above are repeated to connect the die 500 d, 500 e and 500 f by the wire 640 d and 640 e. Finally, the die 500 d is electrically connected to the corresponding inner leads 610 of the lead frame by the wire 640 f. Therefore, the wires 640 a, 640 b, 640 c, 640 d, 640 e are 640 f are connected and the dies 500 a, 500 b, 500 c, 500 d, 500 e and 500 f are connected to the lead frame 600. The materials of the wires 640 are gold. Obviously, the method to form the zigzag-stacked package structure in the present invention is to connect the dies and the lead frame first and then do the wire bonding process to simplify the package procedures.

The molding process is used to form the encapsulated material 90 to cover the zigzag-stacked structure 50A and the inner leads 610 and the die paddle 620 in the lead frame 600. The molding process is done by a pattern, so the molding flow is able to flow into the two sides of the inner lead. The zigzag-stacked structure 30, the zigzag-stacked structure 50 or 50A or the zigzag-stacked structure 70 are stacked crossly, it is able to form the symmetrical structure, even though the number of dies are different, such as the zigzag-stacked structure 30 formed by eight dies 200, the zigzag-stacked structure 50 formed by four dies 500 and the zigzag-stacked structure 70 formed by six dies. Therefore, when the molding flow is flowed into the two sides of the inner leads, it balances the molding flow in two sides of the inner leads. The zigzag-stacked package structure is able to have very good reliability. Besides, the inner lead 610 of the lead frame 600 are existed in the present invention, the vertical distance (d1) between the top edge surface 910 of the encapsulated material 90 and the die 500 f and the vertical distance (d2) between the bottom edge of the die paddle 620 and the bottom edge of the encapsulated material 90 are the same. When the molding process is in proceeding, the molding flow on the die 500 f and the bottom edge of the die paddle 620 are same to form the balance package structure in this embodiment.

FIG. 9 is a plan view showing a zigzag-stacked package structure according to another embodiment of the present invention. As shown in FIG. 9, the zigzag-stacked package structure includes lead frame 600 and a zigzag-stacked structure 50A. The lead frame 600 includes a plurality of inner leads 610, a plurality of outer leads (not shown) and a die paddle 620. The die paddle 620 is disposed between the corresponding inner leads 610 and a height difference is formed between the die paddle 620 and the corresponding inner leads 610. In this embodiment, the zigzag-stacked structure 50A is disposed and connected on the die paddle 620 by the adhesive layer 230. The adhesive layer 230 in the present invention is a sticky gluing material but not limited. The adhesive layer 230 is used to connect the zigzag-stacked structure 50A and the die paddle 620. Therefore, any package structures with the same function of the adhesive material, such as die attached film, are included in the present invention. The wires 640 are used to connect the zigzag-stacked structure 50A and the inner leads 610 of the lead frame 600 after stacking the dies. Obviously, the zigzag-stacked package structure in the present invention is to connect the dies and the lead frame first and then do the wire bonding process to simplify the package procedure. It should be noted that the pads disposed on the dies are not covered by the top die in each of the zigzag-stacked package structures in the present invention. Therefore, the dies are able to connect to the lead frame and then do the wire bonding process. Because the procedure that the wires 640 is used to connect the dies and the lead frame 600 is a prior art, the detail description is omitted.

Still refer to FIG. 9; the lead frame 600 of the zigzag-stacked package structure in this embodiment further includes a bus bar 630 disposed between the die paddle 620 and the corresponding inner leads 610. The height of the bus bar within the lead frame 600 is the same as the height of the die paddle 620 and the inner leads 610 or the height of the bus bar is between the height of the die paddle 620 and the height of the inner leads 610. The bus bar 630 is formed in a bar-like arrangement or ring-like arrangement. Besides, as the description above, the pads 312/344 within the within the wire bonding region 320 of the die 500 is a single line arrangement or a double line arrangement, it is not limited in the present invention. The bus bar 630 is also included in prior art, the detail description is omitted.

FIG. 10 is a sectional view of a zigzag-stacked package structure with a bus bar according to the present invention (according to the section line BB in FIG. 9). As shown in FIG. 10, the lead frame 600 is stacked with six dies 500 to form the zigzag-stacked package structure and is connected by a plurality of wires 640. The lead frame 600 includes a plurality of corresponding inner leads 610, a plurality of outer leads (not shown) and a die paddle 620. The die paddle 620 is disposed between the corresponding inner leads 610 and a height difference is formed between the die paddle 602 and the inner leads 610. The bus bar 630 is disposed between the inner lead 610 and the die paddle 620. One end of the wire 640 a is connected to the first pads 312 a of the die 500 a or the third pads 344 (as the first pads 312 a or the third pads 344 in FIG. 3). The other end of the wire 640 a is connected to the first pads 312 a of the die 500 b or the third pads 344. Then, one end of the wire 640 b is connected to the first pads 312 a of the die 500 b or the third pads. The other end of the wire 640 b is connected to the first pads 312 a of the die 500 c or the third pads 344. The wire 640 c is used to electrically connect the die 500 a and the corresponding inner lead 610 of the lead frame 600. The steps described above are repeated to connect the die 500 d, 500 e and 500 f by the wire 640 d and 640 e. Finally, the die 500 d is electrically connected to the corresponding inner leads 610 of the lead frame by the wire 640 f. Therefore, the wires 640 a, 640 b, 640 c, 640 d, 640 e are 640 f are connected and the dies 500 a, 500 b, 500 c, 500 d, 500 e and 500 f are connected to the lead frame 600. The materials of the wires 640 are gold. Besides, the lead frame 600 in the embodiment includes a bus bar 630 and the height of the bus bar 630 is the same as the height of the inner lead 610. Therefore, during the connection steps of the wires 640, by the need of the connection of the circuit, some of the wires 640 are optionally connected to the bus bar 630. Therefore, the bus bar 630 of the lead frame 600 is used to be a connective point, such as a power connective point, a grounding point or a signal connective point. The bus bar 630 is useful in circuit design. The bus bar 630 is disclosed in prior art, the detail description is omitted.

At final, the molding process is used to form the encapsulated material 90. This embodiment is the same as the embodiment in FIG. 8, when the molding flow is flowed into two sides of the inner lead to balance the two sides of the molding flow. The inner lead 610 of the lead frame 600, the die paddle 620 and the bus bar 630 are existed in the present invention, the vertical distance (d1) between the top edge surface 910 of the encapsulated material 90 and the die 500 f and the vertical distance (d2) between the bottom edge of the die paddle 620 and the bottom edge of the encapsulated material 90 are the same. When doing the molding process, the molding flow on the die 500 f and the bottom edge of the die paddle 620 are same to form the balance package structure in this embodiment.

FIG. 11 is a plan view showing another embodiment showing a zigzag-stacked package structure of the present invention. As shown in FIG. 11, the zigzag-stacked package structure includes circuit substrate 800 and the zigzag-stacked structure 70. The substrate is used to support the zigzag-stacked structure (30, 50, 50A or 70). The wires 640 are used to connect the metal ends or metal lines 810 on the circuit substrate 800 and the zigzag-stacked structure 70 in order to connect the external circuit. The adhesive material 230 described above is also used to connect the zigzag-stacked structure 70 and the circuit substrate 800. The material of the circuit substrate 800 is a printed circuit board (PCB), ceramic substrate or a substrate with a core layer made by BT resin or FR-4 resin. Besides, in order to connect the external circuit, the reverse surface of the substrate, the surface used to connect the zigzag-stacked structure 70, includes the metal points or the metal lines 810 disposed thereon by redistribution layer (RDL) or through-hole process. Therefore, the solder ball is used to connect, such as a ball grid array (BGA) package structure. Obviously, the pads on the dies are not covered by the topper dies in the zigzag-stacked package structure of the present invention. After the dies are connected to the circuit substrate 800, the wire bonding process is proceeding to simplify the package procedures.

FIG. 12 is a section view showing a zigzag-stacked package structure of the present invention (according to the sectional line CC in FIG. 11). As shown in FIG. 12, a plurality of the wires 640 are used to connect the package substrate 800 and the zigzag-stacked structure 70. The wires 640 are used to electrically connect the dies 500 on the zigzag-stacked structure 70 and the metal ends 810 on the package substrate 800. The materials of the wires 640 are gold. The molding process is used to form the encapsulated material 90 covering the zigzag-stacked structure 70 and the circuit substrate 800. 

1. A zigzag-stacked package structure comprising: a lead frame including a plurality of inner leads, a plurality of outer leads and a die paddle and wherein the die paddle is disposed between the inner leads and a height difference formed between the die paddle and the inner leads; a zigzag-stacked structure is fixedly connected on the die paddle and the zigzag-stacked structure includes a plurality of first dies and a plurality of second dies, which are alternatively and respectively stacked to each other, and the first dies, the second dies and the inner leads are electrically connected; an encapsulated material covering the zigzag-stacked structure and the lead frame, and the outer leads are extended over the encapsulated material; Wherein one side of an active surface on each of the first dies and the second dies structure respectively includes a plurality of pads disposed thereon and the other side of an active surface on each of the first dies and the second dies structure respectively includes a plurality of pads disposed thereon.
 2. The package structure of claim 1, wherein each of the dies in the zigzag-stacked structure comprises: a die body including a wire bonding region, wherein the wire bonding region is closed to one side or two adjacent sides of the die body and includes a plurality of first pads disposed within the wire bonding region and a plurality of second pads disposed outside of the wire bonding region; a first protective layer disposed on the die body, wherein the first protective layer includes a plurality of first openings to expose the first pads and the second pads; a redistribution layer disposed on the first protective layer, wherein the redistribution layer is extended from the second pads to the wire bonding region, the redistribution layer includes a plurality of third pads disposed within the wire bonding region; and a second protective layer covering on the redistribution layer, wherein the second protective layer includes a plurality of second openings used to expose the first pads and the third pads.
 3. The package structure of claim 1, wherein the dimension of the stacked area of the two dies on the bottom of the zigzag-stacked structure is bigger than one haft of the dimension of one of the two dies.
 4. A zigzag-stacked package structure comprising: a lead frame including a plurality of inner leads, a plurality of outer leads, at least one bus bar and a die paddle, and wherein the die paddle is disposed between the inner leads and a height difference formed between the die paddle and the inner leads, the bus bar is disposed between the inner leads and the die paddle; a zigzag-stacked structure is fixedly connected on the die paddle and the zigzag-stacked structure includes a plurality of first dies and a plurality of second dies, which are alternatively and respectively stacked to each other, and the first dies, the second dies and the inner leads are electrically connected; an encapsulated material covering the zigzag-stacked structure and the lead frame, and the outer leads are extended over the encapsulated material; Wherein one side of an active surface on each of the first dies and the second dies structure respectively includes a plurality of pads disposed thereon and the other side of an active surface on each of the first dies and the second dies structure respectively includes a plurality of pads disposed thereon.
 5. The package structure of claim 4, wherein the bus bar and the die paddle are in the same surface.
 6. The package structure of claim 4, wherein the bus bar and the inner leads are in the same surface.
 7. The package structure of claim 4, wherein the bus bar, the inner leads and the die paddle form a height difference.
 8. The package structure of claim 4, wherein the dimension of the stacked area of the two dies on the bottom of the zigzag-stacked structure is bigger than one haft of the dimension of one of the two dies.
 9. A zigzag-stacked package structure, comprising: a package substrate including a plurality of metal ends disposed thereon; and a zigzag-stacked structure is fixedly connected on a circuit substrate and the zigzag-stacked structure includes a plurality of first dies and a plurality of second dies, which are alternatively and respectively stacked to each other, and the first dies, a plurality of exposed pads on the second dies and the metal ends on the circuit substrate are electrically connected.
 10. The package structure of claim 9, wherein each of the dies in the zigzag-stacked structure comprises: a die body including a wire bonding region, wherein the wire bonding region is closed to one side or two adjacent sides of the die body and includes a plurality of first pads disposed within the wire bonding region and a plurality of second pads disposed outside of the wire bonding region; a first protective layer disposed on the die body, wherein the first protective layer includes a plurality of first openings to expose the first pads and the second pads; a redistribution layer disposed on the first protective layer, wherein the redistribution layer is extended from the second pads to the wire bonding region, the redistribution layer includes a plurality of third pads disposed within the wire bonding region; and a second protective layer covering on the redistribution layer, wherein the second protective layer includes a plurality of second openings used to expose the first pads and the third pads.
 11. The package structure of claim 10, wherein the dimension of the stacked of the two dies on the bottom of the zigzag-stacked structure is bigger than one half of the dimension of one of the two dies.
 12. A zigzag-stacked package structure comprising: a package substrate including a plurality of metal ends disposed thereon; and a zigzag-stacked structure is fixedly connected on a circuit substrate and the zigzag-stacked structure includes a plurality of first dies and a plurality of second dies, which are alternatively and respectively stacked to each other, and the first dies, the second dies and the metal ends on the circuit substrate are electrically connected; Wherein one side of an active surface on each of the first dies of the zigzag-stacked structure includes a plurality of pads disposed and exposed thereon and the other side of the active surface on each of the second dies includes a plurality of pads disposed and exposed thereon.
 13. The package structure of claim 12, wherein each of the dies in the zigzag-stacked structure comprises: a die body including a wire bonding region, wherein the wire bonding region is closed to one side or two adjacent sides of the die body and includes a plurality of first pads disposed within the wire bonding region and a plurality of second pads disposed outside of the wire bonding region; a first protective layer disposed on the die body, wherein the first protective layer includes a plurality of first openings to expose the first pads and the second pads; a redistribution layer disposed on the first protective layer, wherein the redistribution layer is extended from the second pads to the wire bonding region, the redistribution layer includes a plurality of third pads disposed within the wire bonding region; and a second protective layer covering on the redistribution layer, wherein the second protective layer includes a plurality of second openings used to expose the first pads and the third pads.
 14. The package structure of claim 12, wherein the dimension of the stacked area of the two dies on the bottom of the zigzag-stacked structure is bigger than one half of the dimension of one of the two dies.
 15. A zigzag-stacked package structure comprising: a circuit substrate including a plurality of metal ends disposed on a top surface and the metal ends is connected with a connective line disposed on the reverse surface to connect and a plurality of metal balls; and a zigzag-stacked structure connected on the top surface of the circuit substrate and the zigzag-stacked structure includes a plurality of first dies and a plurality of second dies, which are alternatively and respectively stacked to each other, and the first dies, the second dies and the metal ends on the circuit substrate are electrically connected; Wherein one side of an active surface on each of the first dies of the zigzag-stacked structure includes a plurality of pads disposed and exposed thereon and the other side of the active surface on each of the second dies includes a plurality of pads disposed and exposed thereon.
 16. The package structure of claim 15, wherein the dimension of the two dies on the bottom of the zigzag-stacked structure is bigger than one half of the dimension of one of the two dies.
 17. A zigzag-stacked package structure comprising: a lead frame including a plurality of inner leads, a plurality of outer leads and a die paddle and wherein the die paddle is disposed between the inner leads and a height difference formed between the die paddle and the inner leads; a zigzag-stacked structure connected on the die paddle and the zigzag-stacked structure includes a plurality of first dies and a plurality of second dies, which are alternatively and respectively stacked to each other, and the first dies, a plurality of exposed pads on the second dies and the inner leads are electrically connected; and an encapsulated material covering the zigzag-stacked structure and the lead frame, and the outer leads are extended over the encapsulated material.
 18. A zigzag-stacked package structure comprising: a lead frame including a plurality of inner leads, a plurality of outer leads and a die paddle and wherein the die paddle is disposed between the inner leads and a height difference formed between the die paddle and the inner leads; a zigzag-stacked structure is fixedly connected on the die paddle and the zigzag-stacked structure includes two first dies and two second dies, which are alternatively and respectively stacked to each other, and the two first dies and the two second dies are stacked to each other with a shift distance in order to expose a plurality of pads on each of the dies; a plurality of metal wires used to electrically connect the exposed pads on the two first dies and the two second dies and the inner leads; and an encapsulated material covering the zigzag-stacked structure and the lead frame, and the outer leads are extended over the encapsulated material.
 19. A zigzag-stacked package structure comprising: a lead frame including a plurality of inner leads, a plurality of outer leads and a die paddle and wherein the die paddle is disposed between the inner leads and a height difference formed between the die paddle and the inner leads; a zigzag-stacked structure is fixedly connected on the die paddle and the zigzag-stacked structure includes three first dies and a three second dies, which are alternatively and respectively stacked to each other, and the three first dies and the three second dies are stacked to each other with a shift distance in order to expose a plurality of pads on each of the dies; a plurality of metal wires used to electrically connect the exposed pads on the three first dies and the three second dies and the inner leads; and an encapsulated material covering the zigzag-stacked structure and the lead frame, and the outer leads are extended over the encapsulated material.
 20. A zigzag-stacked package structure comprising: a package substrate including a plurality of metal ends disposed thereon and a zigzag-stacked structure is fixedly connected on the circuit substrate and the zigzag-stacked structure includes two first dies and two second dies, which are alternatively and respectively stacked to each other, and the two first dies, the two second dies and the metal ends on the circuit substrate are electrically connected; Wherein one side of an active surface on each of the first dies of the zigzag-stacked structure includes a plurality of pads disposed and exposed thereon and the other side of the active surface on each of the second dies includes a plurality of pads disposed and exposed thereon.
 21. A zigzag-stacked package structure comprising: a circuit substrate including a plurality of metal ends disposed thereon and a zigzag-stacked structure connected on the circuit substrate and the zigzag-stacked structure includes three first dies and three second dies, which are alternatively and respectively stacked to each other, and the three first dies, the three second dies and the metal ends on the package substrate are electrically connected; Wherein one side of an active surface on each of the first dies of the zigzag-stacked structure includes a plurality of pads disposed and exposed thereon and the other side of the active surface on each of the second dies includes a plurality of pads disposed and exposed thereon. 